03.04.2006 11:09:00
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SUSS MicroTec Supplies 8'' Wafer Bonding Equipment to MiPlaza
"Today's MEMS market requires flexibility, accuracy andreliability in process equipment that enables the fabrication of awide variety of devices," comments Michael Griesinger, account managerfor MiPlaza at SUSS MicroTec. "Highly accurate aligned substratebonding especially plays a significant role throughout the whole MEMSmanufacturing process. We are honoured that MiPlaza selected SUSS torealize these new and innovative components."
Substrate bonding represents the final step in the manufacturingprocess sequence in which multiple wafers or substrates are attachedtogether using a number of physical and chemical effects. The SB8e isa semi-automatic, computer-controlled, stand-alone wafer bonder thatcan be used to design and fabricate novel microstructures with a levelof process control previously not available. Representing the latestgeneration of SUSS substrate bonders, the system features rigidvacuum-pressure chambers, upper and lower independent heaters, andwafer stack loading arms.
The bonder can be equipped with tooling and alignment fixturesthat support all known bonding processes. A wide array ofsemiconductor materials with wafer and substrate diameters ranging upto 200mm can be accommodated as well.
About MiPlaza
Microsystems Plaza (MiPlaza), part of Philips Research, providesshared use and access to state-of-the-art industrial researchinfrastructure, cleanrooms, high-tech equipment, service support andconsultancy to enable the execution of research and developmentprograms of organizations that are leading in innovation. Access toworld-class clean room facilities (2650 m(2), class 100-10000), test &measurement labs, support in the design and realization of electronichard- and software prototypes, services for thin-film process- anddevice development, materials analysis and reliability testing areoffered by a staff of 250 engineers and experts.
For more information, visit http://www.miplaza.com
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process andtest technology for the semiconductor industry. SUSS maintains itsleadership position with over 7,000 systems installed worldwide. SUSSproducts include coating developing systems, 1X full-field lithography(1XFFL) systems, substrate bonders, flip-chip bonders and probesystems. Headquartered in Munich, Germany, SUSS has 5 internationalmanufacturing sites and provides support from sales and servicecenters in North America, Europe, Asia and Japan.
For more information, please visit http://www.suss.com
All statements in this release other than historical facts areforward-looking statements within the meaning of U.S. PrivateSecurities Litigation Reform Act of 1995. Words such as "believe","expect", "intend", "anticipate", "estimate", "should", "may", "will","plan" and similar words and terms used in relation to the enterpriseare meant to indicate forward-looking statements of this kind. Thecompany accepts no obligation toward the general public to update orcorrect forward-looking statements. All forward-looking statements aresubject to various risks and uncertainties, as a result of whichactual events may diverge numerically from expectations. Theforward-looking statements reflect the view at the time they weremade.
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Analysen zu SUSS MicroTec SE (ex SÜSS MicroTec)mehr Analysen
23.01.25 | SUSS MicroTec Halten | DZ BANK | |
23.01.25 | SUSS MicroTec Buy | Deutsche Bank AG | |
22.01.25 | SUSS MicroTec Buy | Joh. Berenberg, Gossler & Co. KG (Berenberg Bank) | |
21.01.25 | SUSS MicroTec Sell | UBS AG | |
20.01.25 | SUSS MicroTec Buy | Deutsche Bank AG |
Aktien in diesem Artikel
SUSS MicroTec SE (ex SÜSS MicroTec) | 49,10 | 3,70% |
Indizes in diesem Artikel
Prime All Share | 8 258,99 | 0,01% | |
CDAX | 1 816,76 | 0,02% | |
Technology All Share | 4 066,16 | -0,25% |