Comet joins JOINT3 Consortium

Comet announced today that, through its IXS division, it has joined the JOINT3 Consortium (“JOINT3”) to develop next-generation semiconductor packaging. Comet’s involvement reflects its strategy to broaden the application scope of its x-ray technologies, positioning the company at the forefront of innovation in semiconductor packaging and inspection. 

JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies. JOINT3 brings together global leaders in the semiconductor supply chain. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic interposers.

Conventional manufacturing methods involve cutting rectangular pieces from circular wafers. However, as interposers increase in size, the number of them that can be obtained from a single wafer is decreasing, posing a significant challenge. To address this issue, a manufacturing process that transitions from circular wafer shapes to square panel shapes is gaining attention, as it allows for a greater number of interposers to be produced from a given area of wafer.

Comet
Comet is a globally leading, innovative technology company based in Switzerland with a focus on plasma control and x-ray technology. With premium high-tech components and systems, we enable our customers to both enhance the quality of their products and make their manufacturing more efficient, and eco-friendly. Our innovative solutions are in demand in the semiconductor and electronics market, as well as other industrial sectors such as automotive and aerospace. Headquartered in Flamatt, Switzerland, Comet has a presence in all world markets. We employ more than 1,800 people worldwide, including about 700 in Switzerland. Besides production facilities in China, Denmark, Germany, Malaysia, Switzerland and the USA, we maintain various other subsidiaries in Canada, China, Japan, Korea, Taiwan and the USA. Comet (COTN) is listed on the SIX Swiss Exchange.

Resonac
Resonac is a functional chemical company established as a result of the integration of Showa Denko and former Hitachi Chemical in January 2023.  The Company’s sales revenue of semiconductor and electronic materials business for 2024 was about 450 billion yen.  The Company is a world-class leader particularly in semiconductor materials for packaging process.  The integration of the two companies has enabled Resonac to design functions of materials as well as to develop them in-house, going all the way back to raw materials.  The trade name “RESONAC” was created as a combination of two English words, namely, the word of “RESONATE” and “C” as the first letter of CHEMISTRY.  The Company will make the most of its co-creative platform, and accelerate technological innovation with semiconductor manufacturers, material manufacturers, and equipment manufacturers inside and outside Japan.
 
For detail, please refer to the Website of Resonac Holdings Corporation: https://www.resonac.com/